Award Abstract #9115964
Metal Colloids and Thin Films
NSF Org: |
OISE
Office of International Science and Engineering
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Initial Amendment Date: |
March 5, 1992 |
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Latest Amendment Date: |
March 5, 1992 |
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Award Number: |
9115964 |
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Award Instrument: |
Standard Grant |
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Program Manager: |
Osman Shinaishin
OISE Office of International Science and Engineering
O/D OFFICE OF THE DIRECTOR
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Start Date: |
March 1, 1992 |
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Expires: |
February 28, 1995 (Estimated) |
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Awarded Amount to Date: |
$13790 |
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Investigator(s): |
Kenneth Klabunde kenjk@ksu.edu (Principal Investigator)
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Sponsor: |
Kansas State University
2 FAIRCHILD HALL
MANHATTAN, KS 66506 785/532-6804
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NSF Program(s): |
SCIENCE IN DEVELOPING COUNTRIE
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Field Application(s): |
0522100 High Technology Materials, 12 Chemistry
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Program Reference Code(s): |
1964
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Program Element Code(s): |
5929
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ABSTRACT
This Science in Developing Countries award will support the collaboration of Kenneth Klabunde of Kansas State University and Galo Cardenas- Trivino of the University of Conception, Chile. The project aims to (1) prepare M-solvent colloids with Cu, Ag, and Sn, and with monomers such as styrene and methylmethacrylate; (2) characterize colloidal particles by electrophoresis, TEM, SEM, FTIR, Mossbauer, and SRS; and (3) characterize metallic films formed from the colloids by TGA, DSC, microanalyses, and resistivity measurements. The researchers will use a new method for preparing nonaqueous colloidal metal particles, using metal evaporation and solvation of atoms in excess cold organic solvents. The mobile metal atoms cluster upon warming. The forming particles stop growing due to solvation and electrostatic repulsion. Various metals have been shown to form stable colloidal solutions. The major interest in these new colloids is in their use as metallic film precursors. The researchers aim to develop them for chemical liquid (rather than vapor) deposition of films. With a recent patent, much industrial interest has developed. This joint project is expected to facilitate progress in metal- colloid, metal film work. The U.S. side has expertise in colloid chemistry and state-of-the-art equipment for preparing and analyzing colloidal solutions and metal films. The Chilean side has expertise in polymer characterization and necessary TGA, DSC, and TEM/SEM facilities, which the U.S. side lacks.
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