Sponsor: Packaging Machinery Manufacturers Institute (PMMI), Arlington, VA,
Site: McCormick Place, Chicago, Illinois, USA
Dates: November 9-13, 2008
Industry: Food Processing/Packaging Equip
Fees: Exhibits – Free to IBP; Conferences – TBD;
Size: 1,245,000 nsf Exhibitors: 2,136 Attendees: 45,000
Show Description: PACK EXPO International 2008 will focus on the latest developments in packaging technology and will showcase the exhibitors’ state-of-the-art advances in packaging machinery, converting machinery, materials packages and containers, and components. Emphasis is placed upon having machinery operational during the show, using materials supplied by the exhibitors.
Technical Program: PACK EXPO International and FPM EXPO, will feature a three-day conference program for both visitors and exhibitors on global issues of interest. Details of this program and costs will be announced.
Marketing Program: PMMI has developed an aggressive international marketing campaign designed to attract the greatest number of attendees with the greatest possible buying power.
Attendee Benefits: International Business Center, equipped with lounge/meeting areas, credit card phones, special registration, translators, business center (fax, copying, etc.). An international reception is sponsored by PMMI for exhibitors to invite their international VIP guests. IBP delegations of 15 or more receive a private PACK EXPO International briefing to familiarize the group with the scope of the show and services.
International Attendee Profile: Corporate managers, engineers, manufacturers, quality controllers, purchasers, production supervisors, research/development, sales & marketing, represent 85% of the PACK EXPO International attendees in a broad range of industries: food & beverage, dairy/meat, pharmaceutical/medical, chemical/household, computer, electronics, components, converting, volume printing, toys & games, aerospace, entertainment, private label, seafood, wineries, confectionery, bakery, snack food, etc.