Title: Low-Pass Fiber Optics to Chip Alignment

Aliases: None

Technical Challenge: Aligning a fiber optic cable to an integrated chip via direct coupling using current industry standards is very cumbersome, time consuming, and subject to signal loss.

Description: This technique is a unique means to align fiber optics to a photonic integrated chip that results in lower back reflections, lower insertion losses, easier alignment, and a more rugged package. It uses a ball lens, standard single mode fiber, low index fluid, and a custom-built index photonic chip. The technique is inexpensive to implement, easily scales up to handle multiple fibers simultaneously, and blends well with automated manufacturing.

    Demonstration Capability: A demonstration is not available.

    Potential Commercial Application(s): This technology offers great benefits to manufacturers of electronic components within the information technology industry.

    Patent Status:A patent application has been filed with USPTO.

    Reference Number: 1307

    If you are interested in exploring this technology further, please call 443-445-7159 or express your interest in writing to the National Security Agency, Domestic Technology Transfer Program, 9800 Savage Road, Suite 6541, Fort George G. Meade, Maryland 20755-6541.