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Letter to High Technology Industry Representatives
June 19, 2003

We are pleased to announce that, on Tuesday, July 1, 2003, the U.S. Department of Commerce will be hosting a one-day “Financing Innovation Forum” at the Ronald Reagan Building International Trade Center in Washington, D.C. to discuss critical issues relevant to the furtherance of U.S.- India high technology cooperation. As an industry executive who has an interest in the U.S. India relationship, we extend an invitation to you to participate in this important event that will bring together key government and business leaders.

The July 1 Forum is the first part of the inaugural gathering of the U.S.-India High Technology Cooperation Group (HTCG) that has garnered a great deal of attention at senior levels of the U.S. and Indian governments. The HTCG was initiated as a result of a November 2001 agreement between President Bush and Prime Minister Vajpayee to strengthen and stimulate bilateral high technology commerce towards realizing their goal of transforming U.S.-India relations. The HTCG consists of senior government representatives from both countries and seeks to identify steps to foster the environment for U.S.-India high-technology to flourish.

Both the U.S. and Indian Governments are looking to the Forum for private sector input on issues affecting high technology trade, investment, and cooperation between the two countries. This input will inform subsequent intergovernmental policy discussions. Led by senior-level U.S. and Indian government officials and distinguished private sector representatives experienced in the high technology relationship, the Forum’s panels will discuss the challenges to creating the right climate for U.S.-India high-technology trade and investment, the factors that influence those trade and investment decisions, and the impediments that exist to financing innovation.

The Forum also will have break-out sessions focusing on bilateral cooperation and financing in the information technology, defense technologies, life sciences, and nanotechnology areas. There will be ample opportunity for audience interaction, and we would welcome your participation at this seminal conference. Your expertise and input would help guide us as we work to enhance the U.S.-India high technology relationship.

Attached is an agenda that provides additional detail. There is no charge for participation in the Forum, although pre-registration is required. Space is limited, so please fax [email] the attached registration form as soon as possible to reserve your space in the Forum. Should you have any questions, please contact Ms. Corie Mullen at (202) 482-9173. We look forward to meeting with you in July for very productive discussions.

Signature of Ken Juster
Signature of Phillip Bond
Kenneth I. Juster
Under Secretary
for Industry and Security
Phillip J. Bond
Under Secretary
for Technology

 

 

 


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