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Microelectronics Manufacturing Infrastructure (MMI) Photonics Manufacturing: Results, Challenges and Opportunities Supporting Technologies for Semiconductor Lithography Advanced Wireless Communications: Are We Ready?
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Supporting Technologies for Semiconductor Lithography | |||||||||||||||||||||||
| Tuesday, November 16, 1999 | |
| 2:00 p.m. | "Introduction
and Welcome" 
Purabi Mazumdar, ATP |
| 2:10 p.m. |
Technology Overview and Needs of the Industry: 100nm and beyond Lloyd Harriott, Lucent Technologies Charles W. Gwyn, EUV LLC John J. Shamaly, SVGL Hans Pfeiffer, IBM |
| 3:10 p.m. | Open Discussion: Working with ATP
Coordinated by: Pat Gardner, SEMI/SEMATECH |
| 3:55 p.m. Coffee Break | |
| 4:10 p.m. | "Intelligent
Mask Inspection Systems for Next Generation Lithography"
Noah Bareket, KLA-Tencor Corporation Anthony Novembre, Lucent Technologies Scott Hector, EUV-LLC Greg Hughes, Dupont Photomasks, Inc. Darren Taylor, Photronics, Inc. |
| 5:00 p.m. |
Early Prototype Non-Gallium Ion Beam for Lithography and Wafer Manufacturing Diane K. Stewart, Micrion Corporation |
| 5:20 p.m. |
Metrology Development at NIST Stephen Knight, NIST |
| 5:30 p.m. | "A
Novel Method for Fabricating CD Reference Materials with 100 nm Linewidths"
Richard A. Allen, NIST |
| 5:45 p.m. | "Sharp
Carbon AFM Tips for Sub-Nanometer Surface Roughness and Accurate Linewidth
Measurements" Ronald G. Dixson, NIST |
| 6:00 p.m. |
Wrap-up / Q&A |
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