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The Manufacturing Science & Technology Center develops and applies advanced manufacturing processes for realization
of products in support of Sandia’s primary mission of
ensuring that the nation’s nuclear weapons stockpile is
safe, secure, and reliable. Components for the stockpile are
typically complex electro-mechanical or electronic parts designed
to withstand harsh environments with high reliability.
The Center focuses on enhancing manufacturing capabilities
in four key areas:
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Manufacture of engineering hardware,
• Emergency and specialized production of weapon
components,
• Development of robust manufacturing processes,
and
• Design and fabrication of unique production
equipment.
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The
Manufacturing Science & Technology Center is committed to
working with other Sandia organizations, industry, federal agencies,
and universities to accomplish its mission.
Sandia's
Manufacturing Science & Technology Center would like
to provide your organization with expertise in the areas of
manufacturing research and development, as well as engineering
hardware at The Advanced Manufacturing Processes Laboratory
(AMPL).
AMPL fabricates with meso- and miniature-machining manufacturing
processes. Features in the range of 1–50 microns are created
with meso-machining. AMPL can deposit thin films of almost half
the elements on the periodic chart, using processes such as
electron beam evaporation, sputter deposition, reactive deposition,
and atomic layer deposition (ALD). AMPL uses two focused ion
beam (FIB) tools capable of milling complex 3D microstructures
in a wide variety of materials, including specialty tools such
as end-mills, turning tools, and indenters. Other meso-machining
tools at AMPL are: micro-milling, diamond turning, femto-second
laser machining, and micro-electro discharge machining.
Technologies
| Encapsulation |
Many
of the components we work with are encapsulated in either
highly filled epoxies or in foams of varying density. Encapsulation
is performed for a variety of reasons, including high voltage
standoff, shock and vibration isolation, stress relief,
environmental isolation, etc.
We not only perform encapsulation, but we conduct research
into the component-encapsulation adhesive bond, fracture
of the adhesive bond, the stress developed during cure,
cure kinetics of the encapsulant material, and the effect
of inclusions on the bulk stress field. We have worked to
develop more environmentally friendly substitutes for the
traditional epoxies and foams. We can help you choose an
encapsulant material, develop a cure schedule that minimizes
stress on the components, test the encapsulant, and actually
perform the encapsulation.
Capabilities:
• Encapsulation:
Foams, elastomers, and rigid resins (epoxies,
silicones and polyurethanes) are used to protect
electrical devices from shock and vibration. These
encapsulants provide rugged protection and help
to ensure a long service life for the component.
We have the expertise to design molds, fixture
parts and perform the encapsulation.
• Large Scale
Foaming: We have experience foaming
oversized objects; often in complicated geometries.
• Materials
Selection: We will work with you
to select materials that have the desired properties,
a processing routine compatible with the components
being encapsulation, a chemistry that is compatible
with the components, and minimal environmental
hazards.
• Cleaning/Surface
Preparation: We use a variety
of surface preparation techniques such as: solvent
cleaning (both traditional and alternative), plasma
cleaning, sandblasting, chemical etching and priming.
• Encapsulant
Research: We perform research
into the stresses developed as a result of curing,
the mechanisms behind interface debonding, and
flow visualization of the filler materials. We
have worked to develop simple tools for characterizing
the flow parameters of a highly filled polymer.
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Resources:
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Abrasive blasters
• Microprocessor controlled ovens
• Autoclaves up to 4 ft. diameter x 8 ft.
long
• High shear planetary mixer
• UV Curing
• Walk-in oven
• Dry wall (walk-in hood)
• Vacuum casting equipment
• Plasma cleaner
• Terpene based cleaning system
• Class 100 clean bench
• Gradient cure apparatus
• Environmental temperature cycling with
optional humidity control
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Accomplishments:
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As a result of flow visualization experiments, modified
the encapsulation process for the neutron generator
- dramatically increasing the yield and cutting the
process fill time.
• Validated encapsulation cure stress models for
the neutron generator that were used to decrease the
cure time by a factor of two.
• Development of simple tools for characterizing
the flow properties of flip-chip underfill encapsulation
material.
• Development of a desktop model for the flow
of flip-chip packaging underfill material through a
solder bump field. The model predicts the flow pattern
and formation of voids.
• Small lot production of multiple components
(Manganin Foil Gauges, Neutron Generators, Current Stacks,
and Thermal Batteries) under weapons reserve quality
guidelines.
• Sandia President's Quality Award (Gold) for
small lot production of active ceramics.
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Thin
Films
The
Thin Film laboratory within Manufacturing Science & Technology
provides a variety of vapor deposition processes and facilities
for cooperative research and development. Available capabilities
include electron beam evaporation, sputter deposition, reactive
deposition processes, atomic layer deposition (ALD) and specialized
techniques such as focused ion beam induced chemical vapor deposition.
Equipment can be reconfigured for prototyping or it can be dedicated
to long-term research, development and manufacturing. Most sputter
and evaporative deposition systems are capable of depositing multiple
materials.
Deposition Capabilities and Expertise:
Deposition
of a large variety of thin film materials For a list of elements
deposited in the past see attached periodic table
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Multiple sputter deposition systems
• Capable of depositing
four materials in a single run
• Substrate heating
during deposition to temperatures as high 600°C
• Provides uniform
(up to 99.5%) film coatings to diameters of 8"
• Automated control
of layer thickness and multilayer design
• Capable of depositing
films uniformly onto complex-shaped substrates such
as tubes, fiber, etc.
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Multiple electron beam evaporation
systems
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Capable of depositing 1-4 materials in a single run
• Substrate heating
during deposition to temperatures as high as 550°C
• Provides uniform
coatings to diameters of 12"
• Capable of depositing
films uniformly onto complex-shaped substrates such
as tubes, fiber, etc.
• Deposition of compounds
by evaporation in the presence of reactive gas possible
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RF/DC
sputter deposition with in-situ sputter etching, RF sputter bias
and reactive sputtering capabilities
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Pulsed DC sputtering also available on two systems
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Current reactive sputter systems offer O2, N2,
H2 or D2 as process gas
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Ion beam sputter deposition using Kaufman ion sources
- Dedicated thin
film deposition systems for growing 'exotic' materials (Pb, In,
Teflon) including ones with high vapor pressures such as ZnS
- Sputter deposition
of magnetic materials including Ni, Fe and Co
- Atomic layer deposition
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Thin conformal coatings on 3-dimensional structures
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Currently depositing metal oxides, sulfides, nitride
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Focused ion beam induced chemical vapor deposition
- Material can be
grown locally onto conductive substrates or layers
- Physical vapor
deposition of precious metals including Pt, Au, Ag
- Sputter deposition
onto transported powder substrates
Multi Layer Thin Films |
Planetary Sputtering Systems |
Analysis capabilities:
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Analysis of thin film stress ex-situ using Flexus Tencor
laser curvature measuring device
• In-situ analysis of thin film stress using MOSS
TM
• Spectroscopic ellipsometry for determining film
thickness, refractive index or multilayer film structure;
measurements can be made into the IR ( of 750 nm to
1.5 µm)
• Focused ion beam sectioning and SEM
• Temperature programmed desorption and depth-profiling
Auger electron spectroscopy analysis system
• Stylus profilometry and interferometric microscopy
instruments for determining roughness, film thickness;
equipment includes Dektak and ADE Phase Shift MicroXAM
instruments
• Sheet resistance measurements
• Adhesion pull tests
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Top of page |
Components
for the stockpile are typically complex electro-mechanical or
electronic parts designed to withstand harsh environments with
high reliability.
Contact
Dr.
Douglas S. Ruby
(dsruby@sandia.gov)
(505)844-0317
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