For more specific information on how many of these
chemicals are used as substitutes for
ozone-depleting
substances, please visit the
SNAP Program's web
site.
HFC-23
(CHF
3)
|
270
264
260
|
12240
11700
12000
|
Byproduct of HCFC-22 used in
very-low temperature refrigeration blend and
component in fire suppression. Also used for plasma
etching and cleaning in semiconductor
production. |
HFC-32
(CH
2F
2)
|
4.9
5.6
5.0
|
543
650
550
|
Blend component of numerous
refrigerants.
|
HFC-41
(CH
3F)
|
2.4
3.7
2.6
|
90
150
97
|
Not in use today.
|
HFC-43-10mee
(C
5H
2F
10) |
15.9
17.1
15 |
1610
1300
1500 |
Cleaning solvent
|
HFC-125
(C
2HF
5) |
29
32.6
29 |
3450
2800
3400 |
Blend component of numerous
refrigerants and a fire suppressant.
|
HFC-134
(C
2H
2F
4) |
9.6
10.6
9.6 |
1090
1000
1100 |
Not in use today.
|
HFC-134a
(CH
2FCF
3) |
14
14.6
13.8 |
1320
1300
1300 |
One of the most widely used
refrigerant blends, component of other refrigerants,
foam blowing agent, fire suppressant and propellant
in metered-dose inhalers and aerosols.
|
HFC-143
(C
2H
3F
3) |
3.5
3.8
3.4 |
347
300
330 |
Not in use today.
|
HFC-143a
(C
2H
3F
3) |
52
48.3
52 |
4400
3800
4300 |
Blend component of several
refrigerant blends.
|
HFC-152a
(C
2H
4F
2) |
1.4
1.5
1.4 |
122
140
120 |
Blend component of several
refrigerant blends and foam blowing agent. Also used
as an aerosol propellant.
|
HFC-227ea
(C
3HF
7) |
34.2
36.5
33.0 |
3660
2900
3500 |
Fire suppressant and propellant
for metered-dose inhalers, and refrigerant.
|
HFC-236fa
(C
3H
2F
6) |
240
209
220 |
9650
6300
9400 |
Refrigerant and fire
suppressant.
|
HFC-236ea
(C
3H
2F
6) |
10.7
--
10.0 |
1350
--
1200 |
Not in use today.
|
HFC-245ca
(C
3H
3F
5) |
6.2
6.6
5.9 |
682
560
640 |
Not in use today; possible
refrigerant in the future.
|
HFC-245fa
(C
3H
3F
5) |
7.6
--
7.2 |
1020
--
950 |
Foam blowing agent and
possible refrigerant in the future.
|
HFC-365mfc
(C
4H
5F
5) |
8.6
--
9.9 |
782
--
950 |
Some use as a foam blowing
agent; possible refrigerant in the future.
|
Perfluoromethane
(CF
4) |
50000
50000
50000 |
5820
6500
5700 |
Plasma etching and cleaning in
semiconductor production and low temperature
refrigerant.
|
Perfluoroethane
(C
2F
6) |
10000
10000
10000 |
12010
9200
11900 |
Plasma etching and cleaning in
semiconductor production.
|
Perfluoropropane
(C
3F
8) |
2600
2600
2600 |
8690
7000
8600 |
Plasma etching and cleaning in
semiconductor production, low temperature refrigerant
and fire suppressant.
|
Perfluorobutane
(C
4F
10) |
2600
2600
2600 |
8710
7000
8600 |
Fire suppressant and
refrigerant where no other alternatives are
technically feasible.
|
Perfluorocyclobutane
(c-C
4F
8) |
3200
3200
3200 |
10090
8700
10000 |
Not used much if any.
Refrigerant where no other alternatives are
technically feasible.
|
Perfluoropentane
(C
5F
12) |
4100
4100
4100 |
9010
7500
8900 |
Not used much if any. Precision
cleaning solvent-low use refrigerant where no other
alternatives are technially feasible.
|
Perfluorohexane
(C
6F
14) |
3200
3200
3200 |
9140
7400
9000 |
Precision cleaning solvent-low
use, refrigerant and fire suppressant where no other
alternatives are technially feasible.
|