2000 Presentations
Because of the large interest in the talks given at this Conference and as a service to the semiconductor community, the organizers have made the slides from many of the talks presented available on this Web site. These slides should be considered the sole property of the speaker. Please do not alter or reproduce any of the slides presented.
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The Conference organizers would like to thank each of the speakers who have made their slides available!
- Peter Borden, Boxer-Cross Co.
Junction Depth Measurement Using Carrier Illumination - Keith Bowen (Bede Scientific) & Dick Deslattes (NIST)
X-ray Metrology by Diffraction and Reflectometry - Dennis Buss, Texas Instruments
Technology in the Internet Era - Alain Diebold, International SEMATECH
Impact of the ITRS Metrology Roadmap - Thaddeus Dziura, Therma-Wave
Guidelines For Selecting Multi-Technology Recipes In Multilayer Filmstack Measurements - Michael Gostein, Philips Analytical
Optoacoustic Metrology for Copper Interconnects Using Impulsive Stimulated Thermal Scattering (ISTS) - Jens Hohne, CSP Cryogenic Spectrometers, Germany
Ultra High Resolution X-ray Detectors - Howard Huff, International SEMATECH
John Bardeen and Transistor Physics - Howard Huff, International SEMATECH
Silicon Wafers for the Mesoscopic Era - William Johnson, Therma-Wave
Semiconductor Material Applications of Rapid X-ray Reflectometry - Ken Monnig, International SEMATECH
The Transition to Cu, Damascene and Low-K Dielectrics for Integrated Circuit Interconnects, Impacts on the Industry - Don Monroe, Lucent
Challenges of Gate Dielectric Scaling, Including the Vertical Replacement-Gate MOSFET - David Muller, Bell Labs, Lucent Technologies
Gate Dielectric Metrology Using Advanced TEM Techniques - Joost Sytsma, ASML
The Status and Future of Imaging Metrology Needs for Lithography - John Woollam, University of Nebraska
Spectroscopic Ellipsometry: From the Vacuum Ultraviolet to the Far Infrared