This U.S. industry comprises establishments primarily engaged in manufacturing wafer processing equipment, semiconductor assembly and packaging equipment, and other semiconductor making machinery.
Cross-References. Establishments primarily engaged in--
| Go to: | No change 2002 to 2007 | No change 1997 to 2002 | 2002 Economic Census and other data sources |
| 2007 NAICS | 2002 NAICS | 1997 NAICS |
Corresponding Index Entries |
|---|---|---|---|
| 333295 | 333295 | 333295 | Etching equipment, semiconductor, manufacturing |
| 333295 | 333295 | 333295 | Micro-lithography equipment, semiconductor, manufacturing |
| 333295 | 333295 | 333295 | Semiconductor assembly and packaging machinery manufacturing |
| 333295 | 333295 | 333295 | Semiconductor making machinery manufacturing |
| 333295 | 333295 | 333295 | Surface mount machinery for making printed circuit boards manufacturing |
| 333295 | 333295 | 333295 | Thin layer deposition equipment, semiconductor, manufacturing |
| 333295 | 333295 | 333295 | Wafer processing equipment, semiconductor, manufacturing |
