Silicon Pixel Sensor R&D
With the pixel sensors positioned to leave a 12mm x 12mm square beam hole, the edges of
the sensors 6mm from the beam will be exposed to a fluence of ~1014 particles/cm2 per year,
given a luminosity of 2 x 1032
cm-2 sec-1. The issues affecting the radiation hardness of sensors
are material and implant type, guard-ring design for high voltage operation, and operating
temperature.
Pictures of the wafer delivered by SINTEF from the joint BTeV/CMS
submission (March, 2000)
 
![sintef-p](Pict_and_Plots/sintef-p_but.gif)
n+ side       p+ side
Pictures of the ATLAS prototype 2 wafer from CiS (April,2000)
 
n+ side       p+ side
I-V curves measured on Simon's cells on SINTEF wafer
I-V curves measured on
FPIXO_SCP on SINTEF wafer. Measurements were also done at Purdue University.
  For further details, please go to:
http://www.physics.purdue.edu/cdf/pixels/sintef/btev/index.html.
I-V curves measured on 3 devices on ATLAS wafer CiS 3696-05
iatlasst.eps
General:
    3 rd annual
status report from RD48 (ROSE) collaboration
    Pictures and Plots (including some not listed here)
    Presentations and Documents
Silicon Pixel Sensor R&D
    Notes on Sensor
    This page is intended for easy reference, it contains nothing profound.
    Sketch of 8x2
module (w/FPIX1's) showing location of bias point (opening in p-side passivation)
Back to RHVD Home Page
Last Updated on 06/20/2000
By Ivelisse Cabrera and German Colon
Send questions to Simon Kwan at swalk@fnal.gov