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DARPA’s EZ BAA Cuts Red Tape to Speed Funding of New Biotech Ideas

EZ BAA
Many businesses and academic researchers wishing to pursue cutting-edge research ideas with government support lack the resources to navigate the burdensome paperwork requirements required to win federal grants or contracts. DARPA’s Biological Technologies Office (BTO) has created a simplified proposal process to attract and fund new ideas from just those types of innovators—those operating at the intersection of biology and technology who may never have worked with the Defense Department and may otherwise have remained too daunted to try.    Article 
EZ BAA
THz World Record 144

DARPA Circuit Achieves Speeds of 1 Trillion Cycles per Second, Earns Guinness World Record

THz World Record 

Officials from Guinness World Records today recognized DARPA’s Terahertz Electronics program for creating the fastest solid-state amplifier integrated circuit ever measured. The ten-stage common-source amplifier operates at a speed of one terahertz (1012 GHz), or one trillion cycles per second—150 billion cycles faster than the existing world record of 850 gigahertz set in 2012.  Article

RE-NET October 144

Atom-width Graphene Sensors Could Provide Unprecedented Insights into Brain Structure and Function

Shield 

Understanding the anatomical structure and function of the brain is a longstanding goal in neuroscience and a top priority of President Obama’s brain initiative. Electrical monitoring and stimulation of neuronal signaling is a mainstay technique for studying brain function, while emerging optical techniques—which use photons instead of electrons—are opening new opportunities for visualizing neural network structure and exploring brain functions. Electrical and optical techniques offer distinct and complementary advantages that, if used together, could offer profound benefits for studying the brain at high resolution. Combining these technologies is challenging, however, because conventional metal electrode technologies are too thick (>500 nm) to be transparent to light, making them incompatible with many optical approaches. Article 

Scout 144

Using Light Frequencies to Sniff Out Deadly Materials from a Distance

Molecular absorption profile superimposed on the modes of an optical frequency comb (courtesy NIST) 

DARPA yesterday issued a solicitation for proposals responsive to its Spectral Combs from UV to THz (SCOUT) program, which seeks new capabilities for highly sensitive remote detection of multiple biological or chemical agents in liquid or gaseous forms. A proposers day is set for Oct. 15 via webcast.  Article

GXV-T Crew Augmentation 1 -144

GXV-T Imagines Future Armored Ground Vehicles that Could Increase Survivability through Improved Situational Awareness

Shield 

One of the key goals of DARPA's Ground X-Vehicle Technologies (GXV-T) program is improving the survivability of ground-based armored fighting vehicles through crew augmentation. Crew augmentation involves improved physical and electronically assisted situational awareness for crew and passengers. It also involves semi-autonomous driver assistance and automation of key crew functions similar to capabilities found in modern commercial airplane cockpits to reduce onboard crew and training requirements. Article 

An Advanced Scanning Optical Microscope (ASOM) at the Naval Surface Warfare Center (NSWC) Crane inspects integrated circuitry components for evidence of tampering and counterfeiting.

DARPA Technology Identifies Counterfeit Microelectronics

Shield 

Advanced software and equipment to aid in the fight against counterfeit microelectronics in U.S. weapons and cybersecurity systems has been transitioned to military partners under DARPA’s Integrity and Reliability of Integrated Circuits (IRIS) program. Researchers with SRI International, an IRIS performer, announced today they have provided Advanced Scanning Optical Microscope (ASOM) technology to the Naval Surface Warfare Center (NSWC) in Crane, Indiana, where it will join an arsenal of laboratory equipment used to ensure the integrity of microelectronics. Article 

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